Capabilities
|
Process
|
Item
|
Description
|
Capability
|
UL Capability
|
Material Cutting
|
Max. Dimension
|
508*622mm(SS) 470*622mm(DS&ML)
|
510*610mm(SS) 558*622mm(DS) 558*610mm(ML)
|
No restriction
|
Inner Layer
|
Min.lin/Space
|
4.0 mil / 4.0 mil
|
4.0 mil / 4.0 mil
|
3.15/3mil
|
Copper Thickness
|
1/3 - 3oz
|
1/3 - 3oz
|
≤3oz
|
Registration Tolerance
|
+/- 0.05mm
|
+/- 0.05mm
|
No requirement
|
Lamination Press
|
Layer Count
|
1 - 8 Layer
|
1 - 8 Layer
|
No requirement
|
Thickness
|
0.4 - 3.2mm
|
0.4 - 3.2mm
|
≥0.38mm
|
Drilling
|
Min. Hole Diameter
|
0.2 mm
|
0.25
|
No requirement
|
PTH Diameter Tolerance
|
+/- 0.08mm
|
+/- 0.08mm
|
No requirement
|
NPTH Diameter Tolerance
|
+/- 0.05mm
|
+/- 0.05mm
|
No requirement
|
Aspect Ratio
|
8:1
|
8:1
|
No requirement
|
Outer Layer
|
Min. Line/Space
|
4.0 mil / 4.0 mi
|
4.0 mil / 3.15 mil
|
Min trace widths 3.15mil, no requirement for min trace
spacing
|
Copper Thickness
|
1/3 - 4oz
|
1/3 - 4oz
|
≥Hoz
|
Registration Tolerance
|
+/- 0.05mm
|
+/- 0.05mm
|
No requirement
|
Impedance Control
|
NG
|
NG
|
|
Process
|
Item
|
Description
|
Uniwell Capability
|
UL Capability
|
Solder Masking
|
Min.Solder Dam
|
0.1mm
|
0.1mm
|
No requirement
|
Min.Solder Mask Opening
|
0.07mm
|
0.07mm
|
No requirement
|
Registration Tolerance
|
+/- 0.1mm
|
+/- 0.1mm
|
≤3oz
|
Solder Mask Plugging
|
≦0.6mm
|
≦0.6mm
|
No requirement
|
Surface Treatment
|
Enig
|
Ni: 2.5-8.0um;
|
Ni: 2.5-8.0um;
|
No requirement
|
OSP
|
0.2-0.5um
|
0.2-0.5um
|
No requirement
|
Immersion Tin
|
0.2 - 0.5um
|
0.8 – 1.0um
|
No requirement
|
Immersion Silver
|
0.8 - 1.0um
|
0.15 – 0.45um
|
No requirement
|
LF-HASL
|
≧1.0um
|
≧2.54um
|
No requirement
|
Out-Line Profiling
|
Profile Tolerance
|
+/- 0.10mm
|
+/- 0.10mm
|
No requirement
|
V-cut Angle Tolerance
|
+/- 5°
|
+/- 5°
|
No requirement
|
V-cut Remain Thickness Tolerance
|
+/- 0.1mm
|
+/- 0.1mm
|
No requirement
|
Final Product
|
Thickness Tolerrance
|
+/- 10%
|
+/- 10%
|
No requirement
|
Warpage Tolerrance
|
+/-0.75%
|
+/-0.75%
|
No requirement
|
|